-
- 1 year warranty
- 1,500,000 hours MTBF
- Up to 2000 MB/s sequential read and Up to 1600 MB/s sequential writes
- Supports PCIe3.0x4 and NVMe 1.3 protocol.
- Supports LDPC ECC to enhance data reliability.
- View information through S.M.A.R.T.
- Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time.
- Supports TRIM to improve read/write performance and speed.
- Low power consumption management.
KSh2,300.00
-
- Product Model - DHI-eHDD-E10-1T
- Capacity - 1 TB
- Read Speed - 140 MB/s
- Write Speed - 140 MB/s
- File System - NTFS
- Operating Temperature - 0°C to +60°C (+32°F to +140°F)
- Storage Temperature - -40°C to +85°C (-40°F to +185°F)
- Operating Humidity - 5%–95% (non-condensing)
- Compatibility - Windows XP/7/8/8.1/10, Linux 2.6, or MAC OS 10.6 and later
- Product Dimensions - 123.5 mm × 78.0 mm × 19.0 mm (4.86" × 3.07" × 0.75")
- Packaging Dimensions - 160 mm × 111 mm × 40 mm (6.30" × 4.37" × 1.57")
- Net Weight - 225 g (0.50 lb)
- Gross Weight - 285 g (0.63 lb)
KSh9,500.00
-
- Model: DHI‑SSD‑C900VND1TB
- Capacity: 1 TB
- Form Factor: M.2 2242 (approx. 22 × 42 mm)
- Interface: PCIe Gen 3.0 ×4
- Protocol: NVMe 1.3
- NAND Flash: 3D NAND
- Sequential Read Speed: Up to 3,400 MB/s
- Sequential Write Speed: Up to 3,000 MB/s
- MTBF (Mean Time Between Failures): ~1,500,000 hours
- TBW (Total Bytes Written): ~1,000 GB? (Exact TBW unspecified)
- Features: LDPC ECC, SMART, TRIM, Garbage Collection, End-to-End Data Protection
- Operating Temperature: 0 °C to +70 °C
- Storage Temperature: –40 °C to +85 °C
- Warranty: Typically 1-year limited warranty (region-dependent)
KSh12,500.00
-
- Adopts high-quality 3D NAND wafer level chip
- Supports PCIe3.0 x4, and NVMe 1.3 protocol
- All-metal cooling plate is included; equipped with intelligent temperature control technology
- Supports TRIM to improve read/write performance and speed
- Supports Max. Write technology for full-disk SLC cache
- Supports LDPC ECC
- Low power consumption management
KSh10,000.00
-
- Adopts high-quality wafer level chip
- Supports SATA III protocol with transmission speed up to 550 MB/s
- View information through S.M.A.R.T
- Provides better read and write performance with TRIM and NCQ
- Low power consumption management
KSh2,400.00
-
- Adopts high-quality wafer level chip
- Supports SATA III protocol with transmission speed up to 550 MB/s
- View information through S.M.A.R.T
- Provides better read and write performance with TRIM and NCQ
- Low power consumption management
KSh9,000.00
-
- Adopts high-quality wafer level chip
- Supports SATA III protocol with transmission speed up to 550 MB/s
- View information through S.M.A.R.T
- Provides better read and write performance with TRIM and NCQ
- Low power consumption management
KSh3,200.00
-
- Adopts high-quality wafer level chip
- Supports SATA III protocol with transmission speed up to 550 MB/s
- View information through S.M.A.R.T
- Provides better read and write performance with TRIM and NCQ
- Low power consumption management
KSh13,000.00
-
- Adopts high-quality wafer level chip
- Supports SATAⅢ protocol with transmission speed up to 550 MB/s
- View information through S.M.A.R.T
- Provides better read and write performance with TRIM and NCQ
- Low power consumption management
- Large TBW
KSh5,000.00
-
- 1 year warranty
- 1,500,000 hours MTBF
- Up to 2000 MB/s sequential read and Up to 1600 MB/s sequential writes
- Supports PCIe3.0x4 and NVMe 1.3 protocol.
- Supports LDPC ECC to enhance data reliability.
- View information through S.M.A.R.T.
- Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time.
- Supports TRIM to improve read/write performance and speed.
- Low power consumption management.
KSh3,100.00
-
- Product Model - DHI-eHDD-E10-2T
- Capacity - 2 TB
- Read Speed - 140 MB/s
- Write Speed - 140 MB/s
- File System - NTFS
- Operating Temperature - 0°C to +60°C (+32°F to +140°F)
- Storage Temperature - -40°C to +85°C (-40°F to +185°F)
- Operating Humidity - 5%–95% (non-condensing)
- Compatibility - Windows XP/7/8/8.1/10, Linux 2.6, or MAC OS 10.6 and later
- Product Dimensions - 123.5 mm × 78.0 mm × 19.0 mm (4.86" × 3.07" × 0.75")
- Packaging Dimensions - 160 mm × 111 mm × 40 mm (6.30" × 4.37" × 1.57")
- Net Weight - 225 g (0.50 lb)
- Gross Weight - 285 g (0.63 lb)
KSh12,500.00
-
- PCIe Gen3.0 × 4.
- Compatible with NVMe 1.3 protocol; high performance and low latency
- View information through S.M.A.R.T.
- Provides better read and write performance with TRIM.
- Adopts LDPC ECC algorithm to enhance data reliability.
- Low power consumption management.
KSh15,000.00
-
- Product Model - DHI-PSSD-T70-2TB
- Capacity - 2TB
- Interface Protocol - USB3.2 Gen2 Type-C
- Read Speed2 - Up to 555 MB/s
- Write Speed2 - Up to 500 MB/s
- TBW - 1240 TB
- Operating Temperature - 0 °C to +50 °C (+32 °F to +122 °F)
- Storage Temperature - –20 °C to +70 °C (–4 °F to +158 °F)
- Operating Humidity 5% – 95% (non-condensing)
- UASP – Yes
- Compatibility - Windows 7/10, Kylin OS, UOS, MAC, Android,ipadOS
- Net Weight - 48.5 g (0.11 lb)
- Gross Weight - 105 g (0.23 lb)
- Product Dimensions - 89 mm × 51 mm × 9 mm (3.50" × 2.01" × 0.35")
- Packaging Dimensions - 120 mm × 77mm × 35 mm (4.72" × 3.03" ×1.38")
- Product Color - Black , Silver
- S.M.A.R.T – Yes
- TRIM – Yes
- Garbage Collection – Yes
- Warranty - 1-year warranty
KSh17,500.00
-
- Product Model - DHI-PSSD-T70-500G
- Capacity - 500 GB
- Interface Protocol - USB3.2 Gen2 Type-C
- Read Speed2 - Up to 555 MB/s
- Write Speed2 - Up to 500 MB/s
- TBW - 310 TB
- Operating Temperature - 0 °C to +50 °C (+32 °F to +122 °F)
- Storage Temperature - –20 °C to +70 °C (–4 °F to +158 °F)
- Operating Humidity 5% – 95% (non-condensing)
- UASP – Yes
- Compatibility - Windows 7/10, Kylin OS, UOS, MAC, Android,ipadOS
- Net Weight - 48.5 g (0.11 lb)
- Gross Weight - 105 g (0.23 lb)
- Product Dimensions - 89 mm × 51 mm × 9 mm (3.50" × 2.01" × 0.35")
- Packaging Dimensions - 120 mm × 77mm × 35 mm (4.72" × 3.03" ×1.38")
- Product Color - Black , Silver
- S.M.A.R.T – Yes
- TRIM – Yes
- Garbage Collection – Yes
- Warranty - 1-year warranty
KSh7,000.00
-
- Model: DHI‑SSD‑C900VND512G
- Capacity: 512 GB
- Form Factor: M.2 2242 (≈22 × 42 mm)
- Interface: PCIe Gen 3.0×4 (NVMe 1.3/1.4)
- NAND Flash: 3D NAND with LDPC ECC
- Sequential Read Speed: Up to 3,400 MB/s
- Sequential Write Speed: Up to 3,000 MB/s
- 4K Random Read IOPS: Estimated up to ~400,000
- 4K Random Write IOPS: Estimated up to ~500,000
- Power Consumption: Active and idle optimized for compact devices
- Features: S.M.A.R.T., TRIM, Garbage Collection, LDPC ECC
- Shock Resistance & Vibration: Designed to meet industrial standards
- Operating Temperature: 0 °C to +70 °C
- Storage Temperature: –40 °C to +85 °C
- Warranty: Typically 1-year limited (region-dependent)
KSh7,500.00
-
- 1 year warranty
- 1,500,000 hours MTBF
- Up to 2000 MB/s sequential read and Up to 1600 MB/s sequential writes
- Supports PCIe3.0x4 and NVMe 1.3 protocol.
- Supports LDPC ECC to enhance data reliability.
- View information through S.M.A.R.T.
- Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time.
- Supports TRIM to improve read/write performance and speed.
- Low power consumption management.
KSh5,500.00
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