1 year warranty 1,500,000 hours MTBF Up to 2000 MB/s sequential read and Up to 1600 MB/s sequential writes Supports PCIe3.0x4 and NVMe 1.3 protocol. Supports LDPC ECC to enhance data reliability. View information through S.M.A.R.T. Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time. Supports TRIM to improve read/write performance and speed. Low power consumption management.
KSh 2,300.00 Product Model - DHI-eHDD-E10-1T Capacity - 1 TB Read Speed - 140 MB/s Write Speed - 140 MB/s File System - NTFS Operating Temperature - 0°C to +60°C (+32°F to +140°F) Storage Temperature - -40°C to +85°C (-40°F to +185°F) Operating Humidity - 5%–95% (non-condensing) Compatibility - Windows XP/7/8/8.1/10, Linux 2.6, or MAC OS 10.6 and later Product Dimensions - 123.5 mm × 78.0 mm × 19.0 mm (4.86" × 3.07" × 0.75") Packaging Dimensions - 160 mm × 111 mm × 40 mm (6.30" × 4.37" × 1.57") Net Weight - 225 g (0.50 lb) Gross Weight - 285 g (0.63 lb)
KSh 9,500.00 Model: DHI‑SSD‑C900VND1TB Capacity: 1 TB Form Factor: M.2 2242 (approx. 22 × 42 mm) Interface: PCIe Gen 3.0 ×4 Protocol: NVMe 1.3 NAND Flash: 3D NAND Sequential Read Speed: Up to 3,400 MB/s Sequential Write Speed: Up to 3,000 MB/s MTBF (Mean Time Between Failures): ~1,500,000 hours TBW (Total Bytes Written): ~1,000 GB? (Exact TBW unspecified) Features: LDPC ECC, SMART, TRIM, Garbage Collection, End-to-End Data Protection Operating Temperature: 0 °C to +70 °C Storage Temperature: –40 °C to +85 °C Warranty: Typically 1-year limited warranty (region-dependent)
KSh 12,500.00 Adopts high-quality 3D NAND wafer level chip Supports PCIe3.0 x4, and NVMe 1.3 protocol All-metal cooling plate is included; equipped with intelligent temperature control technology Supports TRIM to improve read/write performance and speed Supports Max. Write technology for full-disk SLC cache Supports LDPC ECC Low power consumption management
KSh 10,000.00 Adopts high-quality wafer level chip Supports SATA III protocol with transmission speed up to 550 MB/s View information through S.M.A.R.T Provides better read and write performance with TRIM and NCQ Low power consumption management
KSh 2,400.00 Adopts high-quality wafer level chip Supports SATA III protocol with transmission speed up to 550 MB/s View information through S.M.A.R.T Provides better read and write performance with TRIM and NCQ Low power consumption management
KSh 9,000.00 Adopts high-quality wafer level chip Supports SATA III protocol with transmission speed up to 550 MB/s View information through S.M.A.R.T Provides better read and write performance with TRIM and NCQ Low power consumption management
KSh 3,200.00 Adopts high-quality wafer level chip Supports SATA III protocol with transmission speed up to 550 MB/s View information through S.M.A.R.T Provides better read and write performance with TRIM and NCQ Low power consumption management
KSh 13,000.00 Adopts high-quality wafer level chip Supports SATAⅢ protocol with transmission speed up to 550 MB/s View information through S.M.A.R.T Provides better read and write performance with TRIM and NCQ Low power consumption management Large TBW
KSh 5,000.00 1 year warranty 1,500,000 hours MTBF Up to 2000 MB/s sequential read and Up to 1600 MB/s sequential writes Supports PCIe3.0x4 and NVMe 1.3 protocol. Supports LDPC ECC to enhance data reliability. View information through S.M.A.R.T. Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time. Supports TRIM to improve read/write performance and speed. Low power consumption management.
KSh 3,100.00 Product Model - DHI-eHDD-E10-2T Capacity - 2 TB Read Speed - 140 MB/s Write Speed - 140 MB/s File System - NTFS Operating Temperature - 0°C to +60°C (+32°F to +140°F) Storage Temperature - -40°C to +85°C (-40°F to +185°F) Operating Humidity - 5%–95% (non-condensing) Compatibility - Windows XP/7/8/8.1/10, Linux 2.6, or MAC OS 10.6 and later Product Dimensions - 123.5 mm × 78.0 mm × 19.0 mm (4.86" × 3.07" × 0.75") Packaging Dimensions - 160 mm × 111 mm × 40 mm (6.30" × 4.37" × 1.57") Net Weight - 225 g (0.50 lb) Gross Weight - 285 g (0.63 lb)
KSh 12,500.00 PCIe Gen3.0 × 4. Compatible with NVMe 1.3 protocol; high performance and low latency View information through S.M.A.R.T. Provides better read and write performance with TRIM. Adopts LDPC ECC algorithm to enhance data reliability. Low power consumption management.
KSh 15,000.00 Product Model - DHI-PSSD-T70-2TB Capacity - 2TB Interface Protocol - USB3.2 Gen2 Type-C Read Speed2 - Up to 555 MB/s Write Speed2 - Up to 500 MB/s TBW - 1240 TB Operating Temperature - 0 °C to +50 °C (+32 °F to +122 °F) Storage Temperature - –20 °C to +70 °C (–4 °F to +158 °F) Operating Humidity 5% – 95% (non-condensing) UASP – Yes Compatibility - Windows 7/10, Kylin OS, UOS, MAC, Android,ipadOS Net Weight - 48.5 g (0.11 lb) Gross Weight - 105 g (0.23 lb) Product Dimensions - 89 mm × 51 mm × 9 mm (3.50" × 2.01" × 0.35") Packaging Dimensions - 120 mm × 77mm × 35 mm (4.72" × 3.03" ×1.38") Product Color - Black , Silver S.M.A.R.T – Yes TRIM – Yes Garbage Collection – Yes Warranty - 1-year warranty
KSh 17,500.00 Product Model - DHI-PSSD-T70-500G Capacity - 500 GB Interface Protocol - USB3.2 Gen2 Type-C Read Speed2 - Up to 555 MB/s Write Speed2 - Up to 500 MB/s TBW - 310 TB Operating Temperature - 0 °C to +50 °C (+32 °F to +122 °F) Storage Temperature - –20 °C to +70 °C (–4 °F to +158 °F) Operating Humidity 5% – 95% (non-condensing) UASP – Yes Compatibility - Windows 7/10, Kylin OS, UOS, MAC, Android,ipadOS Net Weight - 48.5 g (0.11 lb) Gross Weight - 105 g (0.23 lb) Product Dimensions - 89 mm × 51 mm × 9 mm (3.50" × 2.01" × 0.35") Packaging Dimensions - 120 mm × 77mm × 35 mm (4.72" × 3.03" ×1.38") Product Color - Black , Silver S.M.A.R.T – Yes TRIM – Yes Garbage Collection – Yes Warranty - 1-year warranty
KSh 7,000.00 Model: DHI‑SSD‑C900VND512G Capacity: 512 GB Form Factor: M.2 2242 (≈22 × 42 mm) Interface: PCIe Gen 3.0×4 (NVMe 1.3/1.4) NAND Flash: 3D NAND with LDPC ECC Sequential Read Speed: Up to 3,400 MB/s Sequential Write Speed: Up to 3,000 MB/s 4K Random Read IOPS: Estimated up to ~400,000 4K Random Write IOPS: Estimated up to ~500,000 Power Consumption: Active and idle optimized for compact devices Features: S.M.A.R.T., TRIM, Garbage Collection, LDPC ECC Shock Resistance & Vibration: Designed to meet industrial standards Operating Temperature: 0 °C to +70 °C Storage Temperature: –40 °C to +85 °C Warranty: Typically 1-year limited (region-dependent)
KSh 7,500.00 1 year warranty 1,500,000 hours MTBF Up to 2000 MB/s sequential read and Up to 1600 MB/s sequential writes Supports PCIe3.0x4 and NVMe 1.3 protocol. Supports LDPC ECC to enhance data reliability. View information through S.M.A.R.T. Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time. Supports TRIM to improve read/write performance and speed. Low power consumption management.
KSh 5,500.00
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