Motherboard: ASUS Prime Z790-P WIFI
Processor: Intel Core i9-14900KF
Cooling: DeepCool LE520 240mm ARGB AIO CPU Liquid Cooler (Black)
Memory: Kingston Fury Beast 32GB (2x16GB) DDR5 5600MHz RAM (Black)
Storage:
Kingston NV2 1TB PCIe NVMe M.2 SSD
Seagate Desktop 3.5″ 1TB Hard Drive
Graphics Card: ZOTAC GAMING GeForce RTX 4070 Twin Edge OC 12GB GDDR6X
Power Supply: Deep Cool PF750D 750W 80 Plus Standard
KSh 390,000.00
Key Features
Gem 2 in 1 binding machine cw-3421
plastic comb
binder strip
wire o ring
click ring
punching capacity : 25 sheets (70g) binding
hole distance: 14.3mm (comb) and 8.47mm (wire 3:1 )
depth margin: 2.5/4.5/8.5mm
purching hole quantity : 21 holes (comb) and 34 holes (wire 3:1)
KSh 25,000.00
Key Features
Air Discharge 8kV
Auto MDI/MDIX Yes
Comply with RoHS 6 Yes
Contact Discharge 4kV
Control 802.3x Flow
Dimensions 130 x 79 x 22mm
Energy Efficiency Ethernet (EEE) Yes
FAN Fanless
Flash Memory Size 64KBytes
Head-of-line (HOL) Blocking Prevention Yes
Interfaces 8 x 1000Base-T
Jumbo Frame 9,720 Bytes
MAC Address Table Size 4,000
Max. Packet Forwarding Rate 11.90 Mps
Maximum Heat Dissipation 16.368 BTU/h
Maximum Power Consumption 4.80 W
MTBF 1,061,267 hours
Operating Altitude 2000m
Operating Humidity 0% ~ 95% RH
Operating Temperature 0 ~ 40 °C
Packet Buffer Size 192KBytes
Power Input AC:100 ~ 240 V
Power Saving By Cable Length Yes
Power Saving By Link Status YES
Standby Power Consumption 0.7 W
Storage Humidity 0% ~ 95% RH
Storage Temperature - 10 ~ 70 °C
Store & Forwarding Forwading Yes
Surge/Lightning Protection AC Power Inet: 1kV
All Ethernet Ports: 1kV
Switch intelligence Unmanaged
Switching Capacity 16 Gbps
Weight 130 g
KSh 3,500.00
Key Features
Wireless standard: Wireless N
Wireless speed: 300 Mbps 2.4 GHz
Antenna type: 2 fixed omni-directional antennas
Wired interface: 1 x Fast Ethernet LAN
Wireless modes: Access Point (AP), Wireless client, Wireless extender
KSh 3,500.00
1 year warranty
1,500,000 hours MTBF
Up to 2000 MB/s sequential read and Up to 1600 MB/s sequential writes
Supports PCIe3.0x4 and NVMe 1.3 protocol.
Supports LDPC ECC to enhance data reliability.
View information through S.M.A.R.T.
Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time.
Supports TRIM to improve read/write performance and speed.
Low power consumption management.
KSh 2,300.00
Model: DHI‑SSD‑C900VND1TB
Capacity: 1 TB
Form Factor: M.2 2242 (approx. 22 × 42 mm)
Interface: PCIe Gen 3.0 ×4
Protocol: NVMe 1.3
NAND Flash: 3D NAND
Sequential Read Speed: Up to 3,400 MB/s
Sequential Write Speed: Up to 3,000 MB/s
MTBF (Mean Time Between Failures): ~1,500,000 hours
TBW (Total Bytes Written): ~1,000 GB? (Exact TBW unspecified)
Features: LDPC ECC, SMART, TRIM, Garbage Collection, End-to-End Data Protection
Operating Temperature: 0 °C to +70 °C
Storage Temperature: –40 °C to +85 °C
Warranty: Typically 1-year limited warranty (region-dependent)
KSh 12,500.00
Adopts high-quality 3D NAND wafer level chip
Supports PCIe3.0 x4, and NVMe 1.3 protocol
All-metal cooling plate is included; equipped with intelligent temperature control technology
Supports TRIM to improve read/write performance and speed
Supports Max. Write technology for full-disk SLC cache
Supports LDPC ECC
Low power consumption management
KSh 10,000.00
Adopts high-quality wafer level chip
Supports SATA III protocol with transmission speed up to 550 MB/s
View information through S.M.A.R.T
Provides better read and write performance with TRIM and NCQ
Low power consumption management
KSh 2,400.00
Adopts high-quality wafer level chip
Supports SATA III protocol with transmission speed up to 550 MB/s
View information through S.M.A.R.T
Provides better read and write performance with TRIM and NCQ
Low power consumption management
KSh 9,000.00
Adopts high-quality wafer level chip
Supports SATA III protocol with transmission speed up to 550 MB/s
View information through S.M.A.R.T
Provides better read and write performance with TRIM and NCQ
Low power consumption management
KSh 3,200.00
Adopts high-quality wafer level chip
Supports SATA III protocol with transmission speed up to 550 MB/s
View information through S.M.A.R.T
Provides better read and write performance with TRIM and NCQ
Low power consumption management
KSh 15,500.00
Adopts high-quality wafer level chip
Supports SATAⅢ protocol with transmission speed up to 550 MB/s
View information through S.M.A.R.T
Provides better read and write performance with TRIM and NCQ
Low power consumption management
Large TBW
KSh 5,000.00
1 year warranty
1,500,000 hours MTBF
Up to 2000 MB/s sequential read and Up to 1600 MB/s sequential writes
Supports PCIe3.0x4 and NVMe 1.3 protocol.
Supports LDPC ECC to enhance data reliability.
View information through S.M.A.R.T.
Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time.
Supports TRIM to improve read/write performance and speed.
Low power consumption management.
KSh 3,100.00
PCIe Gen3.0 × 4.
Compatible with NVMe 1.3 protocol; high performance and low latency
View information through S.M.A.R.T.
Provides better read and write performance with TRIM.
Adopts LDPC ECC algorithm to enhance data reliability.
Low power consumption management.
KSh 15,000.00
Model: DHI‑SSD‑C900VND512G
Capacity: 512 GB
Form Factor: M.2 2242 (≈22 × 42 mm)
Interface: PCIe Gen 3.0×4 (NVMe 1.3/1.4)
NAND Flash: 3D NAND with LDPC ECC
Sequential Read Speed: Up to 3,400 MB/s
Sequential Write Speed: Up to 3,000 MB/s
4K Random Read IOPS: Estimated up to ~400,000
4K Random Write IOPS: Estimated up to ~500,000
Power Consumption: Active and idle optimized for compact devices
Features: S.M.A.R.T., TRIM, Garbage Collection, LDPC ECC
Shock Resistance & Vibration: Designed to meet industrial standards
Operating Temperature: 0 °C to +70 °C
Storage Temperature: –40 °C to +85 °C
Warranty: Typically 1-year limited (region-dependent)
KSh 7,500.00
1 year warranty
1,500,000 hours MTBF
Up to 2000 MB/s sequential read and Up to 1600 MB/s sequential writes
Supports PCIe3.0x4 and NVMe 1.3 protocol.
Supports LDPC ECC to enhance data reliability.
View information through S.M.A.R.T.
Adopts high-quality 3D NAND wafer level chip and with 4K LDPC technology, the program-erase cycle is effectively improved to extend service time.
Supports TRIM to improve read/write performance and speed.
Low power consumption management.
KSh 5,500.00
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